Prime-Grade Silicon/Silica Wafers

We offer the ultra-flat silicon and silica wafers (2 inches ~ 6 inches) of the prime grade to our laboratory-based clients for various research applications. These silicon and SiO2 thermal oxide wafer are perfect for chemical deposition or cell growth. The 5 mm x 5 mm and 10 mm x 10 mm diced chips are ideal for direct AFM and SEM imaging. The silica substrates are silicon substrates uniformly coated with a 200 nm thermally grown SiO2 surface layer. Compared with the transitional chemical vapor deposition (CVD) method, the thermal oxidation provides a higher uniformity and a higher dielectric strength. For our silicon wafers coated with oxide layers (i.e. SiO2 fused silica wafer), we only use the dry process involving molecular oxygen to create the dry thermal oxide layer (100 nm ~ 500 nm) for all the thermal layers on top of the silicon wafers. 

  • Key Data:

    For all our Silicon/SiO2 thermal oxide wafer substrates:

    Prime/CZ Virgin grade;
    Orientation: <100>;
    Type:  P/Dopant: Boron;
    TIR < 3 μm, TTV < 10 μm, BOW < 10 μm, Roughness < 0.5 nm

  • Sizes Available for our Prime-Grade Single-Side Polished Silicon Wafers: 


       Six inches 6'' (diameter: 150 +/- 0.4 mm) wafers with a thickness of 650 µm +/- 20 µm;
       Four inches 4'' (diameter: 100 +/- 0.4 mm) wafers with a thickness of 525 µm +/- 10 µm;
       Three inches 3'' (diameter: 76.2
 +/- 0.3 mm) wafers with a thickness of 400 µm +/- 10 µm;
       Two inches 2'' (diameter: 50.8 +/- 0.3 mm) wafers with a thickness of 300 µm +/- 10 µm;

 

       Silicon wafers with different thicknesses are offered on a customized basis. Please contact us for more details.

 

  • Sizes Available for our Prime-Grade Single-Side Polished Silica Wafers (i.e. Silicon Wafers Coated with 200 nm Dry Thermal Oxide Layers): 


       Six inches 6'' (diameter: 150 +/- 0.4 mm) wafers with a thickness of 650 µm +/- 20 µm; 
       Four inches 4'' (diameter: 100 +/- 0.4 mm) wafers with a thickness of 525 µm +/- 10 µm;

       Two inches 2'' (diameter: 50.8 +/- 0.3 mm) wafers with a thickness of 300 µm +/- 10 µm;

 

       Silica wafers with different thicknesses are offered on a customized basis. Please contact us for more details.
 

  • Formats Available: 

    1x Piece in a Wafer Carrier; 
    10x Pieces in a Wafer Box;
    25x Pieces in a Wafer Box;

     

  • Single-side polished (i.e. SSP) surfaces are available for all wafers while double-side polished (i.e. DDP) surfaces are available for 4 inches silicon wafers only. For other sized wafers with the DDP surfaces, customized orders can be placed on a minimum order volume of 25 pieces. 
     

  • 5 mm x 5 mm diced chips in gel membrane box (25 pieces per box) are available for silicon/silica substrates with a thickness of 525 µm +/- 20 µm.​ 10 mm x 10 mm diced chips in gel membrane box (25 pieces per box) are available for silicon substrates with a thickness of 650 µm +/- 20 µm. Diced chips with other thicknesses are available on a customized basis. 
     

  • The prime-grade P-type wafers are known for their excellent heat tolerance. No emission of gas or elements is observed for these wafers for heating at 1,000°C / 1832°F. 
     

  • For 2'' ~ 4'' wafers, the variations in orientation <100> are <100> +/- 0.5 degree.
    For 6'' wafers, there are standard wafers and high-precision wafers available. For standard 6'' wafers, the variations in orientation <100> are <100> +/- 4.0 degree and for high-precision 6'' wafers, the variations in orientation <100> are <100> +/- 0.5 degree.
    The only difference between the standard and high-precision wafers is the variation of orientation, and all other technical parameters are the same. Standard wafers are universally applicable for most typical applications involving machine dicing or no dicing whereas high-precision ones are suitable for high-precision applications involving hand-dicing.

Daily Exchange Rates
(updated every 12 hr)

Please visit our online store or Amazon stores for instant purchases or place invoiced orders (Net 30) with us. We typically ship out our in-stock items both domestically and internationally within 1 business day after the order placement.

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Please note:
 

No duties or additional taxes for the orders delivered to Canadian, the US, the UK, and the EU addresses, regardless of the selected sales channel. The value-added tax (VAT) is zero-rated for EU-based clients with locally registered VAT numbers in Europe; otherwise, 20% UK VAT is charged for orders delivered from the UK to clients based in the EU without the VAT registration. Sales tax is also zero-rated for orders delivered to the US and other international destinations.


Orders destined for Canada will be shipped from the Canadian headquarters.

Orders destined for the US will be shipped from one of our two US offices.

Orders destined for the UK and the EU will be shipped from the UK office.

For other International shipping addresses, the recipients are responsible for local duties and taxes.

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