Prime-Grade Silicon/Silica Wafers

We offer ultra-flat silicon and silica wafers (2 inches ~ 6 inches) of the prime grade to our laboratory-based clients for various research applications. These silicon and SiO2 thermal oxide wafers are perfect for chemical deposition or cell growth. The 5 mm x 5 mm and 10 mm x 10 mm diced silicon wafers with or without dry oxide coatings are ideal for direct AFM and SEM imaging. The silica substrates are silicon substrates uniformly coated with a 200 nm thermally grown SiO2 surface layer. Compared with the transitional chemical vapor deposition (CVD) method, thermal oxidation provides a higher uniformity and a higher dielectric strength. For our silicon wafers coated with oxide layers (i.e. SiO2 fused silica wafer), we only use the dry process involving molecular oxygen to create the dry thermal oxide layer (100 nm ~ 500 nm) for all the thermal layers on top of the silicon wafers. For instance, our prime-grade 4-inch silica wafer available in stock is obtained by coating the prime-grade 4-inch silicon wafer with a dry thermal oxide layer of 200 nm. 
 

  • Key Data:

    For our Silicon/SiO2 thermal oxide wafer substrates:

    Prime/CZ Virgin Grade for Standard Wafers and Prime/FZ Grade for Intrinsic Wafers;
    Orientation: <100> or <111>;
    Type:  P/Dopant: Boron or Type:  N/Dopant: Phosphorus ;
    TIR < 3 μm, TTV < 10 μm, BOW < 10 μm, Roughness < 0.5 nm;

Silicon Wafers
silicon wafer
silicon wafer
silicon wafer
silicon wafer
  • Sizes Available for our Prime-Grade Single-Side Polished Silicon Wafers in Stock: 


       Six inches 6'' (diameter: 150 +/- 0.4 mm) wafers with a thickness of 650 µm +/- 10 µm;
       Four inches 4'' (diameter: 100 +/- 0.4 mm) wafers with a thickness of 525 µm +/- 10 µm;
       Three inches 3'' (diameter: 76.2
 +/- 0.3 mm) wafers with a thickness of 400 µm +/- 10 µm;
       Two inches 2'' (diameter: 50.8 +/- 0.3 mm) wafers with a thickness of 300 µm +/- 10 µm;

 

       Silicon wafers with different thicknesses are offered on a customized basis. Please contact us for more details.

 

  • Sizes Available for our Prime-Grade Single-Side Polished Silica Wafers in Stock (i.e. Silicon Wafers Coated with 200 nm Dry Thermal Oxide Layers): 


       Six inches 6'' (diameter: 150 +/- 0.4 mm) wafers with a thickness of 650 µm +/- 10 µm; 
       Four inches 4'' (diameter: 100 +/- 0.4 mm) wafers with a thickness of 525 µm +/- 10 µm;

       Two inches 2'' (diameter: 50.8 +/- 0.3 mm) wafers with a thickness of 300 µm +/- 10 µm;

 

       Silica wafers with different thicknesses are offered on a customized basis. Please contact us for more details.
 

  • Formats Available: 

    1x Piece in a Wafer Carrier; 
    10x Pieces in a Wafer Box;
    25x Pieces in a Wafer Box;

     

  • Single-side polished (i.e. SSP) surfaces are available for all wafers while double-side polished (i.e. DDP) surfaces are available for 4 inches silicon wafers only. For other sized wafers with the DDP surfaces, customized orders can be placed on a minimum order volume of 25 pieces. 
     

  • 5 mm x 5 mm diced chips in gel membrane box (25 pieces per box) are available for silicon/silica substrates with a thickness of 525 µm +/- 20 µm.​ 10 mm x 10 mm diced chips in gel membrane box (25 pieces per box) are available for silicon substrates with a thickness of 650 µm +/- 20 µm. Diced chips with other thicknesses are available on a customized basis. 
     

  • The prime-grade P-type wafers are known for their excellent heat tolerance. No emission of gas or elements is observed for these wafers for heating at 1,000°C / 1832°F. 
     

  • For 2'' ~ 4'' wafers, the variations in orientation <100> are <100> +/- 0.5 degree.
    For 6'' wafers, there are standard wafers and high-precision wafers available. For standard 6'' wafers, the variations in orientation <100> are <100> +/- 4.0 degree and for high-precision 6'' wafers, the variations in orientation <100> are <100> +/- 0.5 degree.
    The only difference between the standard and high-precision wafers is the variation of orientation, and all other technical parameters are the same. Standard wafers are universally applicable for most typical applications involving machine dicing or no dicing whereas high-precision ones are suitable for high-precision applications involving hand-dicing.

4 inches silicon wafer

4 inches silicon wafer

3 inches Silicon Wafer

3 inches Silicon Wafer

2 inches Silicon Wafer

2 inches Silicon Wafer

6 inches Silicon Wafer

6 inches Silicon Wafer

silicon/silica substrates

silicon/silica substrates

Silicon Wafers
silicon wafers

Daily Exchange Rates
(updated every 12 hr)

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Please note:
 

1. We accept both online purchases at our online store or Amazon stores and invoiced orders (Net 30 Terms). In-stock items will be dispatched within 1-3 business days and the lead time for customized orders will be evaluated on a case-by-case basis.

2. Orders destined for the US will be shipped from one of our two US offices. Orders destined for the UK and the EU will be shipped from the UK office. Orders destined for Canada will be shipped from our Canadian headquarters. No duties or any additional taxes for the orders delivered to Canadian, US, and UK addresses, regardless of the selected sales channel. For other International shipping addresses, recipients are responsible for local duties and taxes.

3. Free exchanges or full refunds will be offered within 30 days after the order fulfilment without any questions asked if the ordered items fail to meet customer expectations.